Substrate bonding apparatus for liquid crystal display device and method for fabricating the same

ABSTRACT

A substrate bonding apparatus includes a bonding chamber, lower and upper stages positioned at lower and upper spaces at an interior of the bonding chamber, respectively, the lower stage including a first receiving part, a first lifting system having a first support part for supporting a first substrate, the first receiving part receiving the first support part within the lower stage, and a blowing system formed in the first support part to blow air through the first support part.

This is a continuation of application Ser. No. 10/259,368, filed on Sep.30, 2002, now U.S. Pat. No. 6,793,756.

The present invention claims the benefit of Korean Patent ApplicationNos. P2002-15643 filed in Korea on Mar. 22, 2002, and P2002-15966 filedin Korea on Mar. 25, 2002, which are hereby incorporated by references.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a bonding apparatus, and moreparticularly, to a substrate bonding apparatus for manufacturing aliquid crystal display device and a method for driving the substratebonding apparatus.

2. Discussion of the Related Art

In response to an increasing demand for various types of displaysdevices, flat panel type displays such as liquid crystal display (LCD),plasma display panel (PDP), electro-luminescent display (ELD), andvacuum fluorescent display (VFD) have been developed. In particular, LCDdevices have been commonly used because of their high resolution, lightweight, thin profile, and low power consumption. In addition, LCDdevices have been implemented in mobile devices, such as monitors fornotebook computers, and for monitors of computers and televisions.Accordingly, efforts to improve image quality of LCD devices contrastwith benefits of their high resolution, light weight, thin profile, andlow power consumption. In order to incorporate LCD devices as a generalimage display, image qualities such as fineness, brightness, large-sizedarea, for example, must be maintained.

Processes for manufacturing LCD devices according to the related art maybe divided into two different categories: liquid crystal injection andliquid crystal dropping. The liquid crystal injection method includessteps of forming a sealant pattern on one of the first and secondsubstrates to form an injection inlet, bonding the first and secondsubstrates to each other within a vacuum processing chamber, andinjecting liquid crystal material through the injection inlet. Theliquid crystal dropping method, which is disclosed in Japanese Patent.Application No. 11-089612 and 11-172903, includes steps of droppingliquid crystal material on a first substrate, arranging a secondsubstrate over the first substrate, and moving the first and secondsubstrates to join to each other, thereby bonding the first and secondsubstrates to each other.

Compared to the liquid crystal injection method, the liquid crystaldropping method is advantageous in that various process steps, such asforming a liquid crystal material injection inlet, injecting the liquidcrystal material, and sealing the injection inlet are unnecessary sincethe liquid crystal material is predisposed on the first substrate.

FIG. 1 is a cross sectional view of a substrate bonding device prior toa deposition process according to the related art. In FIG. 1, thesubstrate assembly device includes a frame 10, an upper stage 21, alower stage 22, a sealant dispenser (not shown), a liquid crystalmaterial dispenser 30, a processing chamber including an upper chamberunit 31 and a lower chamber unit 32, a chamber moving system 40, and astage moving system 50. The chamber moving system 40 includes a drivingmotor driven to selectively move the lower chamber unit 32 to a firstlocation where outflow of sealant and dropping of liquid crystalmaterial occur, and a second location where the bonding process isperformed. The stage moving system 50 includes another driving motordriven to selectively move the upper stage 21 along a vertical directionperpendicular to the upper and lower stages 21 and 22.

FIG. 2 is a cross sectional view of the substrate bonding device priorto a bonding process according to the related art. In FIG. 2, a processof manufacturing a liquid crystal display device using the substrateassembly device according to the related art includes loading a secondsubstrate 52 onto the upper stage 21 and loading a first substrate 51onto the lower stage 22, as shown in FIG. 1. Then, the lower chamberunit 32 having the lower stage 22 is moved to a first processinglocation by the chamber moving system 40 for sealant and liquid crystalmaterial dispensing. Subsequently, the lower chamber unit 32 is moved toa second processing location for substrate bonding by the chamber movingsystem 40. Thereafter, the upper and lower chamber units 31 and 32 areassembled together by the chamber moving system 40 to form a vacuumtight seal, and a pressure in the chamber is reduced by a vacuumgenerating system (not shown), as shown in FIG. 2.

Then, the upper stage 21 is moved downward by the stage moving system 50at the vacuum state to closely fasten the second substrate 52 fixed tothe upper stage 21 to the first substrate 51 fixed to the lower stage22. Furthermore, the process for bonding the respective substrates toeach other is carried out through a continuous pressurization, therebycompleting the manufacture of the LCD device. Thus, after the bonding ofthe substrates is completed, the upper and lower chamber units 31 and 32are separated from each other, and the lower chamber unit 32 is moved toan unloading position by the chamber moving system 40, and the bondedsubstrates are unloaded.

However, the substrate assembly device according to the related art isproblematic. First, the substrate assembly device according the relatedart fails to provide a subsidiary system for stable loading of thesubstrates onto the upper and lower stages, or unloading the bondedsubstrates from the lower stage, thereby increasing the probability thatthe substrates may be damaged during the loading/unloading process.Specifically, the bonded substrates may partially adhere to an uppersurface of the lower stage during the bonding process. Then, thesubstrate assembly device according the related art unloads the bondedsubstrates without considering whether the substrates have adhered tothe lower stage, thereby creating a high probability that damage to thesubstrates may occur.

Second, the bonded substrates must be unloaded without droop within acentral or circumferential portions of the bonded substrates. However,since the substrate assembly device according to the related art doesnot consider such the droop, an increase in probability that failure dueto warpage of the bonded substrates may occur. Specifically, consideringthat the size of LCD devices are increasing to meet demand, preventingdroop during unloading of the bonded substrates is extremely importantand necessary.

Third, direct contact between the substrate and the stage causes staticelectricity to be generated, which may breakdown inner circuits formedon the substrate. In addition, direct contact between the substrates andthe stages lowers production yield.

Fourth, in the substrate assembly device according to the related art,the second substrate is loaded on the lower stage of the lower chamberunit, is transferred into a position of the upper stage by the chambermoving system to be loaded on the upper stage, and the lower chamberunit is again moved to load the first substrate on the lower stage.Accordingly, a high possibility that the substrates may be loaded atincorrect locations exists and thus misalignment may occur duringloading thereof, thereby increasing the probability that the substratesmay be broken.

SUMMARY OF THE INVENTION

Accordingly, the present invention is directed to a substrate bondingapparatus for manufacturing a liquid crystal display device and methodfor driving the substrate bonding apparatus that substantially obviatesone or more problems due to limitations and disadvantages of the relatedart.

An object of the present invention is to provide a substrate bondingapparatus for manufacturing a liquid crystal display device and methodfor driving the bonding device in which an air-blowing system isincorporated to the lift bar system to prevent static electricitygenerated between the substrate and the stage, and to prevent scratchesdue to the friction of the substrate, whereby the substrate is alignedat a precise position when being mounted on the stage.

Additional features and advantages of the invention will be set forth inthe description which follows, and in part will be apparent from thedescription, or may be learned by practice of the invention. Theobjectives and other advantages of the invention will be realized andattained by the structure particularly pointed out in the writtendescription and claims hereof as well as the appended claims.

To achieve these and other advantages and in accordance with the purposeof the present invention, as embodied and broadly described, a substratebonding apparatus includes a bonding chamber, lower and upper stagespositioned at lower and upper spaces at an interior of the bondingchamber, respectively, the lower stage including at least one receivingpart, a lifting system having a first support part for supporting afirst substrate mounted on the lower stage and a receiving part forreceiving the first support part along a vertical direction inside thereceiving part, and a blowing system formed in the first support part toblow air through the first support part.

In another aspect, a substrate bonding apparatus for bonding first andsecond substrates includes a bonding chamber, lower and upper stagespositioned at lower and upper spaces at an interior of the bondingchamber, respectively, a lifting system for lifting a first substrateonto the lower stage and unloading bonded substrates off of the lowerstage, and a clamping system for clamping and aligning the firstsubstrate on the lower stage and unloading the bonded substrates fromthe lower stage.

In another aspect, a method for driving a substrate bonding apparatuscomprising a bonding chamber provided with upper and lower stages, alifting system for lifting a substrate, and a clamping system forclamping the substrate, the method includes steps of placing thesubstrate at a first position on one of the lifting system and theclamping system, and moving the clamping system to align the substrate.

It is to be understood that both the foregoing general description andthe following detailed description of the present invention areexemplary and explanatory and are intended to provide furtherexplanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the invention and are incorporated in and constitute apart of this specification, illustrate embodiments of the invention andtogether with the description serve to explain the principle of theinvention. In the drawings:

FIG. 1 is a cross sectional view of a substrate bonding device prior toa deposition process according to the related art;

FIG. 2 is a cross sectional view of the substrate bonding device priorto a bonding process according to the related art;

FIG. 3 is a cross sectional view of an exemplary a substrate bondingapparatus according to the present invention;

FIG. 4 is a plan view of an exemplary lower stage and a substratelifting system according to the present invention;

FIG. 5A is a cross sectional view of a portion “A” of FIG. 3 accordingto the present invention;

FIG. 5B is a cross sectional view of an exemplary pedestal according tothe present invention;

FIG. 6 is a perspective view of an exemplary support lifting systemaccording to the present invention;

FIG. 7 is a perspective view of another exemplary support lifting systemaccording to the present invention;

FIG. 8 is a perspective view of an exemplary lower stage, substratelifting system, and clamping system according to the present invention;

FIG. 9 is a perspective view of an exemplary clamping system accordingto the present invention;

FIG. 10 is a plan view showing a misalignment of substrate with theexemplary substrate lifting system and clamping system according to thepresent invention;

FIG. 11 is a cross sectional along I-I of FIG. 10 according to thepresent invention; and

FIG. 12 is a plan view of an exemplary operation process of thesubstrate lifting system and clamping system according to the presentinvention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Reference will now be made in detail to the preferred embodiments of thepresent invention, examples of which are illustrated in the accompanyingdrawings.

FIG. 3 is a cross sectional view of an exemplary a substrate bondingapparatus according to the present invention. In FIG. 3, a substratebonding apparatus for a liquid crystal display may include a bondingchamber 110, upper and lower stages 121 and 122, a stage moving unit, avacuum unit 200, a loader part 300, a substrate lifting system 400, anda clamping system.

The bonding chamber 110 may include a structure suitable for performinga bonding process between respective substrates. The bonding chamber 110may include a single chamber structure have an entry door (not shown).Alternatively, the bonding chamber 110 may include upper and lowerportions (not shown) that may facilitate loading/unloading of therespective substrates. Both the upper and lower portions may move alongboth vertical and horizontal directions. Alternatively, a first one ofthe upper and lower portions may be stationary and a second one of theupper and lower portions may move along the vertical and horizontonaldirections. The bonding chamber 110 may be provided with an air exhausttube 112 for reducing a pressure in an interior of the bonding chamber110 via the vacuum unit 200. In addition, the bonding chamber 110 mayinclude a vent tube 113 for returning the bonding chamber 110 to anatmospheric state by introducing air or other gas (N₂) from an exteriorof the bonding chamber 110. The air exhaust tube 112 and the vent tube113 may be provided with valves 112 a and 113 a, respectively, forselectively opening and closing respective passageways.

The upper and lower stages 121 and 122 may confront each other at upperand lower spaces in the interior of the bonding chamber 110. The lowerand upper stages 122 and 121 may electrostatically adsorb the first andsecond substrates 510 and 520. Specifically, the upper stage 121 may beprovided with an electrostatic chuck 121 a and a plurality of vacuumholes 121 b formed along a circumference of the electrostatic chuck 121a. The electrostatic chuck 121 a may be constructed with at least onepair of electrostatic plates each having opposite polarities.Alteratively, the electrostatic chuck 121 a may be constructed toprovide an electrostatic force using a pair of electrostatic plates eachhaving similar polarities. In addition, the vacuum holes 121 bcommunicate with each other through a unitary pipe line or a pluralityof pipe lines 121 c to receive a vacuum force generated by a vacuum pump123 connected to the upper stage 121.

Likewise, the lower stage 122 may also be provided with at least oneelectrostatic chuck 122 a at an upper portion thereof, and at least onevacuum hole formed along a circumference of the electrostatic chuck 122a. Alternatively, as shown in FIG. 5A, an arrangement of theelectrostatic chuck 122 a and vacuum holes 122 b formed at the uppersurface of the lower stage 122 may not be limited to the arrangement ofthe electrostatic chuck 121 a and the plurality of vacuum holes 121 bformed at the bottom surface of the upper stage 121. The electrostaticchuck 122 a and the plurality of vacuum holes 122 b arranged at theupper surface of the lower stage 122 may be changed to accommodate ageometry of a target substrate and corresponding liquid crystaldispensing areas. However, the plurality of vacuum holes 122 b formed atthe upper surface of the lower stage 122 may not be necessary.

FIG. 4 is a plan view of an exemplary lower stage and a substratelifting system according to the present invention. In FIG. 4, at leastone first receiving part 122 d may be formed at a first portion of theupper surface of the lower stage 122 that corresponds to a dummy area ofa first substrate (not shown) that may be placed on the upper surface ofthe lower stage 122. The location of the first receiving part 122 d maybe positioned at other portions of the upper surface of the lower stage122 to prevent droop of the first substrate (not shown). For example,the first receiving part 122 d may be formed at a portion correspondingto a bottom region of the dummy area located between adjacent cell areasformed on an upper surface of the first substrate. Alternatively, thefirst receiving part 122 d may have a geometry corresponding to a recessor a penetrating hole formed through the lower stage 122. In addition,the first receiving part 122 d may be constructed as a recessed slothaving a penetrating hole formed only at specific portions of therecessed slot.

In FIG. 3, the upper stage moving system may include an upper drivingmotor 133 axially coupled with the upper stage 121 by a moving axis 131.The lower stage moving system may include a lower driving motor 134axially coupled with the lower stage 122 by a rotational axis 132. Theupper and lower driving motors 133 and 134 may be arranged at theexterior or the interior of the bonding chamber 110 to selectively drivethe respective axes 131 and 132.

The vacuum unit 200 may transfer an adsorptive force to the interior ofthe bonding chamber 110 such that the bonding chamber 110 selectivelyforms a vacuum state at the interior thereof. The vacuum unit 200 mayinclude an adsorptive pump for generating the adsorptive force, and aspace provided by the vacuum unit 200 communicates with the air exhausttube 112 of the bonding chamber 110.

The loader part 300 may be arranged as a separate system from thebonding chamber 110 provided with various elements therein. The loaderpart 300 may be arranged at the exterior of the bonding chamber 110 toselectively load respective substrates into the interior of the bondingchamber 110 or unload the same from the interior of the bonding chamber110. The loader part 300 may include a first arm 310 to convey a firstsubstrate 510 upon which a liquid crystal material is dropped, and asecond arm 320 to convey a second substrate 520 upon which a sealant isdispensed.

In FIG. 3, the substrate lifting system 400 may be arranged at theinterior of the bonding chamber 110. Alternatively, the substratelifting system 400 may be arranged at both the exterior and interior ofthe bonding chamber 110. The substrate lifting system 400 may includefirst support parts 410 a selectively received at an interior of thefirst receiving part 122 d (in FIG. 4) and selectively supporting thefirst substrate 510, an elevating axis 420 connected to the firstsupport part 410 a, extending through the first receiving part 122 dfrom the lower stage 122, and for moving the first support parts 410 aup and down, and a driving part 430 connected to the elevating axis 420,for driving the elevating axis 420 to ascend or descend.

The first receiving part 122 d may be formed along a lengthwisedirection at a first portion of the upper surface of the lower stage 122that corresponds to a dummy area of the first substrate 510 in adirection that is the same as the loading/unloading direction of thefirst substrate 510, and the first support parts 410 a may be formedalong the lengthwise direction to correspond to the configuration of thefirst receiving part 122 d. Accordingly, the first support part 410 amay stably support even peripheral portions, thereby preventing droop ofthe peripheral portions when the lifting system is applied toapparatuses for manufacturing a large-sized liquid crystal display.

However, the configuration of the first receiving part 122 d and thefirst support parts 410 a may be changed. For example, the first supportparts 410 a may be formed with a plurality of protrusions at the uppersurface of the first support parts 410 a, so as to decrease a contactarea with the substrate. In addition, the at least two first receivingparts 122 d and the at least two first support parts 410 a may be formedalong a longest side of the lower stage 122, the at least two firstsupport parts 122 d and the at least two first support parts 410 a maybe formed along the shortest side of the lower stage 122, and the atleast one first receiving part 122 d and the at least one first supportpart 410 a may be formed along the longest side and the shortest side ofthe lower stage 122, respectively.

Specifically, the first receiving part 122 d and the first support part410 a may be arranged along another direction different from thedirection as the loading/unloading direction of the first substrate 510.For example, at least one of the first receiving part 122 d and thefirst support part 410 a may be arranged along a direction perpendicularto the loading/unloading direction of the first substrate 510 to formany one of various patterns as viewed from the top, such as “=”, “≡”,“||”, “#”, “|||”, thereby preventing droop of both sides of the firstsubstrate 510.

In particular, any supporting location (or contact location) of thefirst substrate 510 by the first support parts 410 a may be allowed ifthe location assists in preventing the droop of the first substrate 510.It may be preferred that the location be positioned at the bottomsurface of the dummy area between cells formed on the upper surface ofthe first substrate 510.

An interval between the first support parts 410 a installed to beoriented toward the same direction as the loading/unloading direction ofthe first substrate may be set to at least exclude an interference witha moving path of the first arm 310. For example, where the first arm 310has three fingers at a predetermined interval (S) as shown in FIG. 4,the first support parts 410 a may be placed within the interval (S),thereby excluding an interference on the movement of the first arm 310.Simultaneously, other supporting parts 410 b arranged perpendicular tothe loading/unloading direction of the first substrate 510 may be bentdownward at portions into which each finger 311 of the first arm 310 isintroduced, thereby preventing interference with each finger.Alteratively, the other supporting parts 410 b may be bent downward atcentral portion thereof, as shown in FIG. 5B, thereby preventinginterference with the center finger of the first arm 310. Bothcircumferential edges portions of the other supporting part 410 b may beformed to have a length not to be contacted with the fingers arranged atboth sides of the first arm 310 (or, the fingers arranged at both sidesof the first arm are formed at an interval not to interfere with thefirst support part 410 b), as shown in FIG. 5B.

However, if the first support parts 410 a and 410 b are formed longerfor application to large-sized liquid crystal display, droop of bothends of the first support parts 410 a and 410 b may occur. Accordingly,at least two of an elevating axis 420 axially coupled with the firstsupport parts 410 a and 410 b, and at least two of a driving part 430for moving the elevating axis 420 along up and down directions may beprovided at each of corresponding locations of the first and secondsupport parts 410 a and 410 b. For example, each of the elevating axis420 may be connected to corresponding driving parts 430 that areprovided at a crossing portion between the first support part 410 aarranged along the horizontal direction and the first support part 410 barranged along the vertical direction as viewed from the top, or aportion between the central portions of the first support parts 410 aand 410 b and both ends thereof. In addition, the first support parts410 a and 410 b may be shaped like one of bar, round pin, and apolygonal hollow pipe. However, the first support parts 410 a and 410 bmay be formed of any shaped so long as the provide mechanical supportfor the substrates.

In addition, respective faces of the first support parts 410 a and 410b, including a face contacting the first substrate 510, may include acoating material (not shown) to prevent substrate damage, such asscratches caused by the contact between the first support parts 410 aand 410 b and the first substrate 510. The coating material may be amaterial such as polytetrafluorothylene or PEEK, for example, to preventdamage of the first substrate 510, such as scratches, and be anelectrically conducting material to discharge any static electricitygenerated on the first substrate 510.

The driving part 430 of the substrate lifting system 400 may include atleast a step motor and a cylinder. The step motor may move the cylindervertically along the direction of the elevating axis 420 using apneumatic or hydraulic system. The driving part 430 may be fixed to alower space at the interior of the bonding chamber 110, the driving part430 may penetrate a bottom of the bonding chamber 110 to be fixed at alocation at the exterior of the bonding chamber 110. Thus, interferencebetween the various driving parts may be avoided, and easy installationof each of the driving parts may be provided.

FIG. 6 is a perspective view of an exemplary support lifting systemaccording to the present invention. In FIG. 6, a blowing system mayinclude a plurality of blowing holes 410 c for blowing air or gas topush up a substrate mounted on the first support parts 410 a and 410 b,and may be arranged at the first support parts 410 a and 410 b. A gassupply tube 410 d for supplying air or gas to the blowing holes 410 cmay be arranged below the first support parts 410 a and 410 b.

FIG. 7 is a perspective view of another exemplary support lifting systemaccording to the present invention. In FIG. 7, a blowing system mayinclude a blowing slit 410 e for blowing air or gas to push up asubstrate mounted on first support parts 410 a and 410 b, and may beformed at the first support parts 410 a and 410 b. A gas supply tube 410d for supplying air or gas to the blowing slit 410 e may be arrangedbelow the first support parts 410 a and 410 b.

Although not shown in the drawings, a plurality of blowing holes forblowing air or gas onto the upper surface of the lower stage 122 may beformed along with the supply tube for supplying gas or air, or vacuumholes may be formed at the upper and lower stages 121 and 122. The gasor air may be injected through the blowing holes 410 c or the vacuumholes.

FIG. 8 is a perspective view of an exemplary lower stage, substratelifting system, and clamping system according to the present invention,and FIG. 9 is a perspective view of an exemplary clamping systemaccording to the present invention. In FIGS. 8 and 9, a clamping systemmay include a second support part 610 selectively received inside atleast one a second receiving part 122 e recessed at both side edges ofthe upper surface of the lower stage 122 along a direction perpendicularto the loading/unloading direction of the substrate. The second supportpart 610 may be moved along the horizontal direction. One pair of racksand pinions 611 a and 611 b for moving the second support part 610 upand down along a Z axis direction may be arranged at both sides of therear of the second support part 610. A first driving system (i.e., abiaxial motor 630) for transferring electric power to the racks andpinions 611 a and 611 b may be arranged in the interior of the bondingchamber 110 to drive the second support part 610 along the Z-axisdirection. A pair of guide rails 620 for moving the second support part610 along X-axis or Y-axis direction may be arranged in the interior ofthe bonding chamber 110. A second driving system 640 may be arranged inthe interior of the bonding chamber 110 to move the second support part610 in the X-axis direction along the guide rails 620.

The second receiving part 122 e may be formed to have a predeterminedlength with respect to the substrate mounted thereon among the bothedges of the upper surface of the lower stage 122. The second supportpart 610 may be formed to have a length corresponding to the shape ofthe second receiving part 122 e and may push the substrate upward. Thesecond support part 610 may be bent to have a first face supporting thebottom surface of the substrate and a second face supporting the sidesurface of the substrate. In addition, like the first support parts 410a and 410 b, the second support part 610 that contacts the surfaceportions of the first substrate 510 may be coated with materials such aspolytetrafluorothylene or PEEK, for example, to prevent damage caused bythe contact between the second support part 610 and the first substrate510, and electrically conductive materials to dissipate any staticelectricity generated on the first substrate 510.

An exemplary process for manufacturing an LCD device using the substratebonding apparatus according to the present invention will be described.

First, as shown in FIG. 3, the loader part 300 may control therespective arms to be given the first substrate 510 to be loaded ontothe lower stage and the second substrate 520 to be loaded onto the upperstage 121. In this state, the loader part 300 may control the second arm320 to convey the second substrate 520 upon which liquid crystalmaterial is not dropped into the interior of the bonding chamber throughan opening of the bonding chamber 110 such that a face to be bonded ofthe second substrate 520 is directed toward the bottom. Then, the upperstage 121 may descend downward near the conveyed second substrate 520,and the vacuum pump 123 connected with the upper stage 121 may be drivento transfer a vacuum force to the vacuum holes 121 b formed in the upperstage 121, thereby adsorbing the second substrate 520 conveyed by thesecond arm 320. Subsequently, the upper stage 121 may ascend downward.

The loader part 300 may control the first arm 310 to convey the firstsubstrate 510 upon which liquid crystal material is dropped on the uppersurface of the lower stage 122 arranged at a lower space of the bondingchamber 110. In this state, the substrate lifting system 400 and thedriving parts 430 and 530 of the clamping system 600 may be driven tomove the substrate lifting system 400 and the clamping system in theupward direction. As shown in FIG. 8, the first and second support parts410 a and 410 b may be gradually protruded upward from the first andsecond receiving parts 122 d and 122 e to contact the bottom surface ofthe first substrate 510 mounted on the first arm 310. The first andsecond support parts 410 a, 410 b and 610 may be continuously movedupward to withdraw the first substrate 510 from the first arm 310, andmay stop at a specific ascending height. At this time, air or gas may besupplied to the first support parts 410 a and 410 b through the supplytube 410 d, and then blown through the blowing holes 410 c or theblowing slits 410 e to push the first substrate 510 up (in FIGS. 6 and7). To this end, although the first substrate is mounted on the firstsupport parts 410 a and 410 b, direct contact of the first substratewith the upper surfaces of the first support parts 410 a and 410 b areavoided.

When the first substrate 510 is mounted on the upper surfaces of thefirst support parts 410 a and 410 b and contacts the upper surfaces ofthe first support parts 410 a and 410 b, internal stress may not beconcentrated but may be dispersed, so that the first substrate 510 isfully supported and any displacement or droop of the first substrate 510is avoided. Accordingly, contact between the first support parts 410 aand 410 b and the first substrate 510 may include one of face contacts,line contacts, and point contacts.

The first support parts 410 a and 410 b may be coated with a materialsuch as polytetrafluorothylene, PEEK, or an electrically conductingmaterial, and the first substrate 510 is not directly contacted with thefirst support parts 410 a and 410 b by the blowing holes 410 c, toprevent damage to the bottom surface of the first substrate 510 and todischarge any static electricity generated on the first substrate 510.

After the substrate elevating process, once the first arm 310 isextracted out of the bonding chamber 110 by control of the loader part300, the driving parts 430 and 630 may withdraw the respective elevatingaxes in the downward direction. Then, once the first and second supportparts 410 a, 410 b and 610 connected with the elevating axes descend andare placed into the first and second receiving parts 122 d and 122, thefirst substrate 510 mounted on the first and second support parts 410 a,410 b and 610 may be withdrawn from the first and second support parts410 a, 410 b and 610, and then mounted on the upper surface of the lowerstage 122.

After the extraction process and the withdrawal process, the vacuum pumpthat is connected to the lower stage 122 may be driven to transfer avacuum force to the plurality of vacuum holes 122 b. Accordingly, thebottom surface of the first substrate 510 is affixed to the uppersurface of the lower stage 122 by the vacuum force generated by thevacuum pump. Alternatively, the substrate transfer process may includeapplying a potential to the electrostatic plates of the electrostaticchuck 122 a of the lower stage 122, thereby affixing the bottom surfaceof the first substrate 510 to the upper surface of the lower stage 122.As a result, the loading process of the first and second substrates 510and 520 are completed.

After the substrate loading process, the bonding chamber 110 may beclosed and sealed, and the vacuum unit 200 may be driven to reduce apressure of the interior of the bonding chamber 110. Then, once adesired vacuum pressure is attained, a bonding process of the first andsecond substrates 510 and 520 is performed by enabling the stage movingunit to move the upper stage 121 in the downward direction, or byenabling the stage moving unit to move the lower stage 122 in the upwarddirection.

In the aforementioned processes, once the bonding process is performedjust prior to the loading process of the second substrate 520, thesecond arm 320 that has loaded the second substrate 520 may unload thebonded substrates placed on the upper stage 122, and such a process willbe described below.

First, the substrate lifting system 400 and the clamping system 600 maybe driven to move the respective first and second support parts 410 a,410 b and 610 in the upward direction, whereby the bonded substrates maybe separated from the lower stage 122. The upward movement of the firstand second support parts 410 a, 410 b and 610 may continue until theyare positioned at an upper space of the lower stage 122. Likewise, gasor air may be supplied through the first supply tube 410 d to the firstsupport parts 410 a and 410 b and then may be blown through the blowingholes 410 c or the blowing slits 410 e to push the first substrate inupward direction. Accordingly, although the bonded substrates may bemounted on the first support parts 410 a and 410 b, direct contact ofthe first substrate with the upper surfaces of the first support part410 a and 410 b may be avoided. Thus, static electricity and scratchingof the substrate may be prevented, and impact upon the contact of thesubstrate and the lifting system 400 may be alleviated.

Subsequently, the loader part 300 may be controlled to again convey thesecond arm 320 that has loaded the second substrate into the interior ofthe bonding chamber 110. The loading location of the second arm 320 maybe positioned at a lower portion of the bonded substrates that are movedupward by the substrate lifting system 400.

After the conveying process of the second arm 320, once the first andsecond support parts 410 a, 410 b and 610 of the substrate liftingsystem 400 and the clamping system 600 are moved in the downwarddirection, the bonded substrates mounted on the first and second supportparts 410 a, 410 b and 610 may be transferred onto the upper surface ofthe second arm 320. The first and second support parts 410 a, 410 b and610 may continue to move in the downward direction, and may be receivedinside the first and second receiving parts 122 d and 122 e of the lowerstage 122. Afterwards, the second arm 320 may be unloaded outside thebonding chamber 110 by the control of the loader part 300, therebycompleting the unloading of the bonded substrates.

Alternatively, if the unloading process of the bonded substrates iscompleted, loading process of the first substrate 510 may be performedby the first arm 310, the substrate lifting system 400, and the clampingsystem 600. Accordingly, the loading process of the first substrate 510has been previously described and is omitted here.

In a manufacturing method of an LCD, when a substrate is loaded into thelifting system 400 and the clamping system 600 from the first arm 310,misalignment may occur as shown in FIGS. 10 and 11.

FIG. 10 is a plan view showing a misalignment of substrate with theexemplary substrate lifting system and clamping system according to thepresent invention, and FIG. 11 is a cross sectional along I-I of FIG. 10according to the present invention. In FIGS. 10 and 11, once the firstsubstrate 510 is misaligned with the lifting system 400 and the clampingsystem 600, the first support parts 410 a and 410 b of the liftingsystem 400 is further moved along the upward direction so that the firstsubstrate 510 is separated from the second support part 610 of theclamping system 600.

FIG. 12 is a plan view of an exemplary operation process of thesubstrate lifting system and clamping system according to the presentinvention. In FIGS. 9 and 12, a motor 640 of the clamping system 600 maybe driven to move the second support part 610 to a rear side of thefirst substrate 510. Then, a biaxial motor 630 of the clamping system600 may be driven to move the second support part 610 up to the heightof the first support parts 410 a and 410 b (in FIG. 8, for example) ofthe lifting system 600. Subsequently, the motor 640 of the clampingsystem 600 may be driven to forwardly move the second support part 610toward the first substrate 510 by a first distance. Accordingly, themisaligned first substrate 510 may be aligned at a precise position.

If the blowing system formed in the first support parts 410 a and 410 bof the lifting system 400 blows air or gas, as described with FIG. 6,the first substrate 510 is not directly contacted with the first supportparts 410 a and 410 b, thereby preventing scratches on the firstsubstrate 510 and discharging any static electricity generated betweenthe first substrate 510 and the first support parts 410 a and 410 b. Inaddition, where the first substrate 510 is positioned at the lower stage122 and is misaligned, the motor 640 of the clamping system 600 may bedriven to move the second support parts 610 to a rear side of the firstsubstrate 510. Then, the biaxial motor 630 of the clamping system 600may be driven to move the second support part 610 up to the height ofthe first support parts of the lifting system 400. Subsequently, themotor 640 of the clamping system 600 may be driven to forwardly move thesecond support part 610 toward the first substrate 510 by apredetermined distance. Accordingly, the misaligned first substrate 510is aligned at a precise position.

It will be apparent to those skilled in the art that variousmodifications and variations can be made in the present invention. Thus,it is intended that the present invention covers the modifications andvariations of this invention provided they come within the scope of theappended claims and their equivalents.

1. A substrate bonding apparatus for a liquid crystal display device,comprising: a bonding chamber; lower and upper stages within the bondingchamber, the lower stage having a receiving part and penetrating holes;and a lifting system having a first support part selectively receivedwithin the receiving part for supporting a first substrate and aplurality of elevating axes moving up and down through the penetratingholes so that the first support part extends from a first positionwithin the receiving part of the lower stage to a second position abovean upper surface of the lower stage; a blowing mechanism in the firstsupport part, having at least one opening to blow gas or air; a supplytube connected to the first support part to supply the gas or air to theat least one opening; and a blowing system to blow gas or air throughthe at least one opening in the first support part.
 2. The apparatusaccording to claim 1, wherein an upper surface of the first support partis recessed from the upper surface of the lower stage at the firstposition.
 3. The apparatus according to claim 1, wherein the firstsupport part includes a plurality of first supports extending along afirst direction and a plurality of second supports extending along asecond direction perpendicular to the first direction.
 4. The apparatusaccording to claim 3, wherein the plurality of first supports and theplurality of second supports are connected at intersections.
 5. Theapparatus according to claim 4, wherein the lifting system furtherincludes a plurality of driving parts driving the plurality of elevatingaxis.
 6. The apparatus according to claim 3, wherein each of theplurality of first supports include a pair of side portions and centralportion that is offset from the side portions along a third directionperpendicular to the first and second directions.
 7. The apparatusaccording to claim 6, wherein the central portion is disposed betweenadjacent ones of the plurality of elevating axes.
 8. The apparatusaccording to claim 3, wherein the lifting system includes a plurality ofsecond support parts each disposed along opposing side portions of thelower stage.
 9. The apparatus according to claim 8, wherein each of thesecond support parts are positioned within second receiving parts of thelower stage.
 10. The apparatus according to claim 8, wherein each of thesecond support parts disposed along one of the opposing side portions ofthe lower substrate are interconnected and each of the second supportparts disposed along another one of the opposing side portions of thelower substrate are interconnected.
 11. The apparatus according to claim10, wherein each of the second support parts are disposed withinrecesses along the opposing side portions of the lower stage at a firstposition of the elevating axis, and each of the second support parts aredisposed above an upper surface of the lower stage along the opposingside portions of the lower stage at a second position of the elevatingaxis.
 12. The apparatus according to claim 1, wherein the lifting systemincludes a first lifting system that extends to a first position abovean upper surface of the lower stage from a central portion of the lowerstage and a second lifting system that extends to a second positionabove the upper surface of the lower stage from opposing side portionsof the lower stage.
 13. The apparatus according to claim 12, wherein thefirst lifting system retracts to a third position below the uppersurface of the lower stage.
 14. The apparatus according to claim 13,wherein the second lifting system retracts to a fourth position at theupper surface of the lower stage.
 15. The apparatus according to claim13, wherein the second lifting system operates simultaneously with thefirst substrate lifting system.
 16. The apparatus according to claim 12,wherein the second lifting system includes a clamping system forclamping side portions of the first substrate.
 17. The apparatusaccording to claim 16, wherein the clamping system includes a firstdriving system having a pair of rack and pinions.
 18. The apparatusaccording to claim 16, wherein the clamping system includes a seconddriving system having a pair of guide rails.
 19. The apparatus accordingto claim 18, wherein the second driving system is provided within thebonding chamber.
 20. The apparatus according to claim 19, wherein thepair of guide rails align the second lifting system to the lower stage.21. The apparatus according to claim 18, wherein the clamping system isprovided within the bonding chamber.
 22. The apparatus according toclaim 1, wherein the at least one opening includes a plurality of holes.23. The apparatus according to claim 1, wherein the at least one openingincludes a slit.